TSEK06 - VLSI konstruktion

A CDIO course for Y4, D4, IT4, COE and SOCPeriods 3 and 4 Credits: 12 HP

Important Information

Group formation and project selection will take place during the second lecture of the course. If you are unable to attend at that time, you have two options; i) form a group beforehand with fellow students and have them put you on their group list during the selection lecture (make sure that they can give your student ID on the form, and that the group size does not exceed 5 people); or ii) send the head teaching assistant an e-mail and he will try to accomodate you into one of the groups.

Course Description

A comprehensive introduction to design and fabrication of Very Large Scale Integrated (VLSI) circuits in CMOS technology. The course gives an excellent insight into VLSI chip design and high-performance, low-power circuit techniques. The course supports the CDIO project flow and the LIPS project model to promote teamwork and communication skills required by industry to run large and complex design projects.

Courseflow diagram

Course Format

Laborations

Literature

Examination

Grade

Pass or Fail.

Fundamentals of electronics, switching theory, MOS transistors and CMOS technology, radio electronics, digital and analog integrated circuits.

Staff

Available Projects

Links to the specifications on the lisam site for the project of the year is given below:

Deadlines

   
18 Jan 2023 Course start.
18 Jan 2023 Project selection. This will be done at the second lecture.
11 Feb 2023 Deadline for high-level design and simulation report.
18 Mar 2023 Deadline for transistor level design and simulation report.
06 May 2023 Layout, LVS, DRC and parasitic simulation should be complete. Only slight touch ups and integration changes may remain.
16 May 2023 Tape out. Hard deadline for delivery of chip GDSII file.
25 May 2023 Deadline for final project report and oral presentation.
   

Chip Photos